LONDON – Sarawak Microelectronics Design (SMD) Semiconductor has introduced its second proprietary technology, keteq.GaN, during the Microelectronics UK 2025 conference in London.
The gallium nitride-based chip is designed to deliver faster, smaller and more energy-efficient power electronics compared to conventional silicon.
The launch was officiated by the Premier of Sarawak, Datuk Patinggi Tan Sri (Dr) Abang Haji Abdul Rahman Zohari bin Tun Datuk Abang Haji Openg, who described the development as a milestone under the state’s Semiconductor Roadmap 2030 – Beyond Moore’s Law.
He said the combination of GaN technology with SMD’s artificial intelligence platform, keteq.ai, sets new performance benchmarks in energy conversion systems.
The new chip is the product of collaboration with XFab Germany, Cambridge Microelectronics, and the UK’s Compound Semiconductor Applications Catapult (CSAC).
According to the Premier, the partnership highlights how global expertise can accelerate Sarawak’s semiconductor ecosystem.
Industry partners formalised two agreements at the event. The first, involving SMD, Cambridge Microelectronics, XFab Dresden and CSA Catapult, focuses on GaN high electron mobility transistor (HEMT) development.
The second, signed between SMD, Sarawak Energy Berhad (SEB), Weeteq and CSA Catapult, targets the development of an AI-enabled grid-forming power converter to improve stability across datacentres, transport and residential sectors.
SEB will test and validate the technology, while Weeteq will provide AI optimisation and CSA Catapult will support commercialisation.
Premier Abang Zohari acknowledged the role of SEB in bridging innovation from laboratory research to large-scale deployment.
Dato Sri Dr Wan Lizozman Wan Omar, SMD Chairman, emphasised the complementary strengths of the UK and Sarawak. He said the UK contributes infrastructure and academic expertise, while Sarawak offers renewable energy and a strong drive for growth.
Shariman Jamil, SMD Chief Executive Officer, described keteq.GaN as proof that the roadmap is delivering results, citing talent development and intellectual property creation as key achievements.
The announcement was welcomed by CSA Catapult interim CEO Raj Gawera, who noted that its compound semiconductor packaging and integration expertise would help move innovations into scalable real-world applications.
The launch coincided with the Premier’s keynote at the summit, where he introduced the concept of the “Integrated Silicon Longhouse”, a framework symbolising collective progress between government, academia, industry and international partners.
He pointed to Sarawak’s track record in high-tech manufacturing, highlighting major expansions by X-FAB and Melexis in Kuching, alongside a new polysilicon plant in Bintulu.
Sarawak is targeting 10,000 megawatts of renewable energy capacity by 2030 and 15,000 megawatts by 2035, supported mainly by hydropower, solar and biomass. The Premier argued that this provides industries with cost-competitive, low-carbon manufacturing conditions.
He concluded by reaffirming Sarawak’s intention to become a significant global player in semiconductors, underpinned by consistent policies, infrastructure and strategic partnerships.