KUALA LUMPUR – Sarawak Microelectronics Design (SMD) Semiconductor is paving the way for long-term international collaboration following a courtesy visit to the British High Commissioner to Malaysia, His Excellency Ajay Sharma. The meeting, held in Kuala Lumpur, marked a significant step in fostering deeper bilateral cooperation between Sarawak and the United Kingdom in the fields of semiconductors and microelectronics.

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Led by SMD’s Chief Executive Officer (CEO), Shariman Jamil, the visit focused on exploring opportunities for strategic partnerships with UK-based institutions, particularly in advanced semiconductor technologies. Central to the discussion was SMD’s ongoing collaboration with the UK’s Compound Semiconductor Applications Catapult (CSA Catapult), as well as ambitious projects including AI chip integration, chiplet design, and heterogeneous integration.

“These developments signify our long-term vision to position Sarawak as a global hub for high-performance chip design,” said Shariman. He added that the support extended by the British High Commission reaffirms the shared commitment of both regions to push boundaries in innovation.

Shariman also presented the Sarawak Semiconductor Roadmap 2030 – Beyond Moore’s Law, showcasing the state’s long-term technological vision. He briefed the High Commissioner on SMD’s upcoming participation at Microelectronics UK 2025, a prestigious event scheduled for 24–25 September at ExCeL London, where SMD will exhibit key innovations, including the keteq.ai Power Converter Prototype.

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The prototype, developed in collaboration with CSA Catapult, was previously unveiled during an official ceremony in Wales attended by the Premier of Sarawak. It is regarded as a breakthrough in energy-efficient chip technology.

High Commissioner Ajay Sharma welcomed the deepening engagement, stating, “This mutually beneficial collaboration reflects our shared commitment to fostering innovation, enhancing trade relationships, and supporting sustainable development.”

Both parties concluded the meeting with a shared intention to expand cooperation in areas aligned with sustainable, inclusive, and future-ready technological progress.

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